Taiwan Tech and Acon-Holding Inc. have officially signed an industry–academia cooperation memorandum of understanding, announcing plans to engage in deep collaboration in the fields of smart manufacturing, artificial intelligence applications, high-speed transmission technologies, and silicon photonics. By combining academic research capabilities with industry needs, the partnership aims to jointly advance technological upgrades and innovative development in Taiwan’s manufacturing sector.

Taiwan Tech President Jia-Yush Yen (right) and Acon-Holding Inc. General Manager Hung-Yi Chen (left) sign the industry–academia cooperation memorandum of understanding.

In recent years, Acon-Holding Inc. has actively expanded its integrated presence in the electronics components, optical communications, and wireless systems markets. Its business portfolio includes high-frequency connectors and cables, fiber optics and high-speed module solutions, co-packaged optics (CPO) technology, RF and antenna modules, low-earth orbit satellite communication applications, as well as sensors and integrated components for drones and robotics. Following the signing of the industry–academia cooperation memorandum, the partnership will enable in-depth collaboration on technologies such as high-speed server architectures, signal integrity, high-reliability modules, energy efficiency, and thermal management, while establishing technical linkages in future high-growth industry segments.

Taiwan Tech President Jia-Yush Yen delivers a speech.

Taiwan Tech President Jia-Yush Yen emphasized that the industry–academia collaboration mechanism helps align research outcomes more closely with industry needs, enhancing Taiwan’s technological visibility and industrial positioning in high-speed transmission, AI computing, and smart manufacturing. At the same time, ongoing exchanges will continue to focus on corporate technology requirements and application scenarios, with pilot programs and implementation plans guided by maturity levels to strengthen the connection between R&D results and industrial applications, laying the foundation for future collaboration and technological expansion.

As global demand for high-performance computing and data transmission continues to grow, the collaboration will also extend to research and evaluation of key technologies such as silicon photonics and co-packaged optics (CPO), exploring their feasibility in high-speed server and AI systems, including aspects of thermal management, energy efficiency, and system architecture design.

Acon-Holding Inc. General Manager Hung-Yi Chen introduces Acon-Holding Inc.

Acon-Holding Inc. General Manager Hung-Yi Chen stated that this collaboration will focus on the strategic development of high-frequency, high-power, and high-reliability product lines, covering areas such as high-frequency connectors and cables for AI data center high-speed transmission, wireless communications, and low-Earth orbit satellite technologies, drone and robotics components, as well as silicon photonics solutions. He also expressed the intention to leverage AI models, computing power, and smart manufacturing capabilities to enhance overall technological expertise and research and development ( R&D) efficiency. By leveraging Taiwan Tech’s extensive technical resources, the partnership aims to accelerate research and development, enhance system integration capabilities, and expand the application of products in high-value sectors, including high-performance computing, data centers, and advanced communications.

Professor Yih-Lin Cheng, Acting Dean of Taiwan Tech’s College of Industry Innovation, introduces the College.

The signing of this industry–academia cooperation memorandum marks the partnership between Taiwan Tech and Acon-Holding Inc.  in accelerating the R&D and industrial application of advanced technologies. Through the integration of resources enabled by industry–academia collaboration, the agreement aims to establish a sustainable foundation for cooperation in high-growth markets, enhancing Taiwan’s innovative capabilities in key areas such as smart manufacturing, AI, and high-speed transmission, and generating more resilient growth momentum for Taiwan in the global technology supply chain.

Group photo of all participants.